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datashee t product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys. 1/ 23 tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 low duty lcd segment driver for automotive application bu 91796 mu f-m max 80 segments (seg 20 com4) general description bu91796muf-m is a 1/4 duty general-purpose lcd driver that can be used for automotive applications and can drive up to 80 lcd segment s. it can support operating temperature of up to +105c and qualified for aec -q100 grade2, as required for automotive applications. wettable flank qfn package is suitable for small footprint applications and provides significant advantages in inspectability and solder joint reliability . features ? aec -q100 qualified (note) ? integrated ram for display data (ddram): 20 x 4 bit (max 80 segment) ? lcd drive output: 4 common output, max 20 segment output ? integrated buffer amp for lcd driving ? integrated oscillator circuit ? no external components ? low power consumption design (note) grade 2 applications ? instrument clusters ? climate controls ? car audios / radios ? metering ? white goods ? healthcare products ? battery operated applications etc. key specifications supply voltage range: +2.5v to +6.0v operating temperature range: -40c to + 10 5c max segments: 80 segments display duty: 1/4 bias: 1/2, 1/3 selectable interface: 2wire serial interface special characteristics esd(hbm): 2000v latch-up current: 10 0 ma package w (typ.) x d (typ.) x h (max.) typical application circuit internal clock m ode figure 1. typical application circuit vqfn 32 fv 5050 5 .0 mm x 5 .0 mm x 1.0mm controller vdd vlcd sda scl oscin test 1 test 2 vss com 0 com 1 com 2 com 3 seg 0 seg 1 segment lcd vdd seg 19 ? ? ? ? ? ? ? ? ? ? ? ? ? ? insert capacitors between vdd and vss c > 0.1uf downloaded from: http:///
2/ 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 block diagram / pin configuration / pin description figure 2. block diagram figure 3. pin configuration (top view) table 1. pin description pin name pin no. i/o function handling when unused test1 30 i test input (rohm use only) must be connect ed to vss vss test2 31 i por enable setting vdd: por disenable (note1) vss : por enable vss oscin 32 i external clock input external clock and internal clock can be selected by comman d must be connect ed to vss when us ing internal oscillat or vss sda 2 i/o serial data in-out terminal - scl 1 i serial clock terminal - vss 29 - g nd - vdd 28 - power supply - vlcd 27 - power supply for lcd driving - seg0- 19 3- 22 o segment output for lcd driving open com0-3 23 - 26 o common output for lcd driving open ex t-pad - (note2) - substrate open/vss (note1 ) th is function is guaranteed by design, not tested in production process. software reset is necessary to initialize ic in case of test2=vdd. (note2) to radiate heat, contact a board with the ext-pad which is loca ted at the bottom side of vqfn 32 fv5050 package. supply vss level or open state as the input condition for this pad. com2 25 16 com3 26 15 vlcd 27 14 vdd 28 13 vss 29 12 test1 30 11 test2 31 10 oscin 32 9 seg4 seg5 ext-pad seg1 seg2 seg3 scl sda seg0 seg6 1 2 3 4 5 6 7 8 seg9 seg8 seg7 17 seg13 seg12 seg11 seg10 seg15 seg14 24 23 22 21 20 19 18 seg18 seg17 seg16 com1 com0 seg19 test1 test2 lcd bias select or common driver segment driver oscillator power on reset sda scl vlcd oscin vss com 0 com 3 seg 0 seg 19 if filter serial interface command register common counter ddram lcd voltage generator command data decoder blink timing generator vdd downloaded from: http:///
3/ 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 absolute maximum ratings (vss=0v) parameter symbol ratings unit remarks maximum voltage1 vdd -0.5 to +7.0 v power s upply maximum volta ge2 vlcd -0.5 to vdd v lcd drive voltage power dissipation pd 0.70 (note1) w input voltage range vin -0.5 to vdd+0.5 v operational temperature range topr -40 to + 10 5 c storage temperature r ange tstg -55 to +125 c (note1) derate by 7.0mw/c when operating above ta= 25 c (when mounted in rohm ? s standard board). caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry . therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (ta=-40c to + 10 5c , vss=0v) parameter symbol ratings unit remarks min typ max power supply voltage1 vdd 2.5 - 6.0 v power s upply power supply voltage2 vlcd 0 - vdd-2.4 v lcd drive voltage , vdd-vlcd ? 2.4v electrical characteristics dc characteristics (vdd=2.5v to 6.0v, vlcd=0v, vss=0v, ta=-40c to +105c, unless otherwise specified) parameter symbol limits unit conditions min typ max h level input voltage vih 0.7vdd - vdd v sda,scl,oscin l level input voltage vil vss - 0.3vdd v sda,scl,oscin h level input current iih - - 1 a sda,scl,oscin (note2) , test2 l level input current iil -1 - - a sda,scl,oscin, test2 sda l level output voltage vol_sda 0 - 0.4 v iload = 3ma lcd driver on resistance seg r on - 3 - k iload=10a com r on - 3 - k vlcd supply voltage vlcd 0 - vdd-2.4 v vdd-vlcd ? 2.4v standby current idd1 - - 5 a display off, oscillation off power consumption idd2 - 12 .5 30 a vdd=3.3v, vlcd=0v, ta=25 c power save mode1, fr=71hz 1/3 bias, frame inverse (note2) for e xt ernal clock m ode only. downloaded from: http:///
4/ 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 electrical characteristics C continued oscillation characteristics (vdd=2.5v to 6.0v, vlcd=0v, vss=0v, ta=- 40 c to + 10 5c, unless otherwise specified) parameter symbol limits unit conditions min typ max frame frequency1 fclk1 56 80 1 12 hz fr = 80hz setting, vdd=2.5v to 6.0v , ta=-40c to +105c frame frequency2 fclk2 70 80 90 hz fr = 80hz setting, vdd=3.3v, ta=25c frame frequency3 fclk3 77.5 87.5 97.5 hz fr = 80hz setting, vdd=5.0v, ta=25c frame frequency4 fclk4 67.5 87.5 10 8 hz fr = 80hz setting, vdd=5.0v, ta=-40c to +105c external clock rise time tr - - 0.3 s external clock mode (oscin) (note) external clock fall time tf - - 0.3 s external frequency fexclk 15 - 300 khz external clock du ty tdty 30 50 70 % (note) disctl 80hz setting: frame frequency [hz] = external clock [hz] / 5 12 disctl 71hz setting: frame frequency [hz] = external clock [hz] / 5 76 disctl 64hz setting: frame frequency [hz] = external clock [hz] / 6 48 disctl 53hz setting: frame frequency [hz] = external clock [hz] / 7 68 reference data figure 4. typical temperature characteristics 50 60 70 80 90 100 110 -40 -20 0 20 40 60 80 100 temperature [c] frame frequency [hz] vdd = 6.0v vdd = 5.0v vdd = 3.3v vdd = 2.7v downloaded from: http:///
5/ 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 electrical characteristics - continued mpu interface characteristics (vdd=2.5v to 6.0v, vlcd=0v, vss=0v, ta=- 40 c to +105 c , unless otherwise specified) parameter symbol limits unit conditions min typ max input rise time tr - - 0.3 s input fall time tf - - 0.3 s scl cycle time tscyc 2.5 - - s h scl pulse idth tshw 0.6 - - s l scl pulse idth tslw 1.3 - - s sda setup time tsds 100 - - ns sda hold time tsdh 100 - - ns buss free time tbuf 1.3 - - s start condition hold time thd;sta 0.6 - - s start condition setup time tsu;sta 0.6 - - s stop condition setup time tsu;sto 0.6 - - s figure 5. interface timing i/ o equivalen ce circuit figure 6 i/o equivalen ce circuit tbuf sda scl tsdh sda thd; sta ts lw tr ts hw tf tsds tsu; sta tsu; sto tscyc vdd vlcd vss vdd test1 vss sda vss vdd vss scl vss vdd test2 vss vdd oscin vss vdd seg/com vss downloaded from: http:///
6/ 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 application example internal clock m ode external clock m ode figure 7 . example of application circuit controller vdd vlcd sda scl oscin test 1 test 2 vss com 0 com 1 com 2 com 3 seg 0 seg 1 segment lcd vdd seg 19 ? ? ? ? ? ? ? ? ? ? ? ? ? ? controller vdd vlcd sda scl oscin test 1 test 2 vss com 0 com 1 com 2 com 3 seg 0 seg 1 segment lcd vdd seg 19 ? ? ? ? ? ? ? ? ? ? ? ? ? ? downloaded from: http:///
7/ 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 functional descriptions command /data transfer method bu91796muf-m is controlled by 2wire signal (sda, scl). figure 8 . 2 wire command/data transfer format it is necessary to generate start and stop condition when sending com mand or display data through this 2 wire serial interface. figure 9 . interface protcol the following procedure shows how to transfer command and displ ay data. (1) generate start condition. (2) issue slave address. (3) transfer command and display data. (4) generate stop condition acknowledge (ack) data format is comprised of 8 bits, acknowledge bit is returned aft er sending 8-bit data. after the transfer of 8-bit data (slave address, command, display data), release the sda line at the falling edge of the 8th clock. the sda line is then pulled low until the falling edge of the 9th clock scl. (output cannot be pulled high because of open drain nmos). if acknowledge fu nction is not required, keep sda line at low level from 8th fallin g edge to 9th falling edge of scl. figure 10 . acknowledge timing start condition s to p condition sda scl sda scl 1-7 8 9 1-7 8 9 1-7 8 9 slave address ack data ack data ack s p start condition stop condition slave address s 0 1 1 1 1 1 0 0 a c 0 command display data a a p acknowledge start condition command or data judgment bit stop condition downloaded from: http:///
8/ 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 command transfer method issue slave address (01111100) after generat ing start condition. the 1 st byte after slave address always becomes command input. msb (command or data judge bit) of command decide to next data is command or display data. hen set command or data judge bit=?1?, next byte will be co mmand. hen set command or data judge bit=?0? , next byte data is display data. slave address a 1 s command a 1 command a 1 command a 0 command a p display data it cannot accept input command once it enters into display data transfer state. in order to input command again it is necessary to generate start condition . if start condition or stop condition is sent in the middle of command transmission, command wil l be cancelled. if slave address is continuously sent following start condition , it remains in command input state. slave address must be sent right after the start condition . when slave address cannot be recognized in the first data transmission, no acknowledge bit is generated and next transmission will be invalid. when data is invalid st atus, if start condition is transmitted again, it will return to valid status. consider the mpu interface characteristic such as input rise time and setup/hold time when transferring command and data (refer to mpu interface). write display and transfer method bu91796muf-m has display data ram (ddram) of 20 4= 80 bit. the relationship between data input and display data, ddram data and address are as follows; 01111100 a 0 s 0000000 a a b c d e f g h a i j k l m n o p a p display data slave address command 8-bit data is stored in ddram. adset command specifies the address to be written, and address is automatically incremented in every 4-bit data. data can be continuously written in ddram by transmitting data continu ously. when ram data is written successively, after writing ram data to 13h (seg 19 ), the address is returned to 00h (seg0) by the auto-increment function ddram address 00 01 02 03 04 05 06 07 ??? 11h 12h 13h bit 0 a e i m com0 1 b f j n com1 2 c g k o com2 3 d h l p com3 seg0 seg1 seg2 seg3 seg4 seg5 seg6 seg7 seg17 seg18 seg19 display data is written to ddram every 4-bit data. no need to wait for ack bit to complete data transfer. downloaded from: http:///
9/ 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 oscillator the clock signals for logic and analog circuit can be gene rated from internal oscillator or external clock. if internal oscillator circuit is used, oscin must be connected to vss leve l. when using external clock mode, input external clock from oscin termin al after icset command setting. figure 11. internal clock m ode figure 12. external clock m ode lcd driver bias circuit bu91796muf-m generates lcd driving voltage with on-chip buffer amp. and it can drive lcd at low power consumption. 1/3 or 1/2 bias can be set by modeset command. line or frame inversion can be set by disctl command. refer to the lcd driving waveform for each lcd bias setting. blink timing generator bu91796muf- m has blink function. blink mode is asserted by blkctl command. the blink frequency varies depending on fclk characteristics at internal clock mode. refer to oscillation characteristics for fclk. reset initialize condition initial condition after executing software reset is as follows. ? display is off. ? ddram address is initialized (ddram data is not initialized). refer to command description for initial value of registers. command / function list description list of command / function no. command function 1 set ic operation (icset) software reset, internal/external clock setting 2 display control (disctl) frame frequency, power save mode setting 3 address set (adset) ddram address setting (00h to 13h) 4 mode set (modeset) display on/off, 1/2bias or 1/3bias setting 5 blink control (blkctl) blink off/0.5s/1s/2s blink setting 6 all pixel control (apctl) all pixels on/off during disp on oscin bu91796 vss oscin bu91796 vss clock downloaded from: http:///
10 / 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 detailed command description d7 (msb) is a command or data judgme nt bit . refer to command and data transfer method. c: 0: next byte is ram write data. 1: next byte is command. set ic operation (icset) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 1 1 0 1 * p1 p0 ( * : don?t care) set software reset execution. setup p1 no operation 0 software reset execute 1 hen software reset is executed, bu91796muf- m is reset to initial condition. (refer to reset initialize condition) don?t set software reset (p1) with p0 at the same time. set oscillator mode setup p0 reset initialize condition internal clock 0 external clock 1 internal clock mode: oscin must be connect ed to vss level. external clock mode: input external clock from oscin terminal. . disctl 80hz setting: frame frequency [hz] = external clock [hz] / 512 disctl 71hz setting: frame frequency [hz] = external clock [hz] / 576 disctl 64hz setting: frame frequency [hz] = external clock [hz] / 648 disctl 53hz setting: frame frequency [hz] = external clock [hz] / 768 figure 13 . osc mode switch timing command icset oscin_en ( internal signal ) internal clock mode external clock mode internal oscillation ( internal signal ) external clock ( oscin ) downloaded from: http:///
11 / 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 display control (disctl) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 0 1 p4 p3 p2 p1 p0 set power save mode fr. setup p4 p3 reset initialize condition normal mode (80hz) 0 0 power save mode 1 (71hz) 0 1 power save mode 2 (64hz) 1 0 power save mode 3 (5 0hz) 1 1 power consumption is reduced in the follow ing order: normal mode > power save mode1 > power save mode 2 > power save mode 3. set lcd drive waveform. setup p2 reset initialize condition line inversion 0 frame inversion 1 power consumption is reduced in the follow ing or der: line inversion > frame inversion typically, when driving large capacitance lcd, line inversio n will increase the influence of crosstalk. regarding driving waveform, refer to lcd driving waveform. set power save mode sr. setup p1 p0 reset initialize condition power save mode 1 0 0 power save mode 2 0 1 normal mode 1 0 high power mode 1 1 power consumption is increased in the follow ing order: power save mode 1 < power save mode 2 < normal mode < high power mode use vdd- vlcd 3.0v in high power mode condition. (reference current consumption data) setup current consumption power save mode 1 0.5 power save mode 2 0.67 normal mode 1.0 high power mode 1.8 the data above is for reference only . actual consumption depends on panel load. address set (adset) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 0 0 p4 p3 p2 p1 p0 the range of address can be set from 00000 to 10011(bin). don?t set out of range address, otherwise address will be set 0000 0. downloaded from: http:///
12 / 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 mode set (modeset) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 1 0 * p3 p2 * * (* : don ? t care) set display on and off. setup p3 reset initialize condition display off (dispoff) 0 display on (dispon) 1 display off : regardless of ddram data, all segment and common output wi ll be stopped after 1frame of data write. display off mode will be disabled after display on com mand. display on : segment and common output will be active and start to read the displa y data from ddram. set bias level setup p2 reset initialize condition 1/3 bias 0 1/2 bias 1 refer to lcd driving waveform. blink control (blkctl) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 1 1 1 0 * p1 p0 ( * : don ? t care) set blink mode. blink mode (hz) p1 p0 reset initialize condition off 0 0 0.5 0 1 1 1 0 2 1 1 the blink frequency varies depending on fclk characteristics at inter nal clock mode. refer to oscillation characteristics for fclk. all pixel control (apctl) msb d7 d6 d5 d4 d3 d2 d1 lsb d0 c 1 1 1 1 1 p1 p0 all display set on, off setup p1 reset initialize condition normal 0 all pixel on (apon) 1 setup p0 reset initialize condition normal 0 all pixel off (apoff) 1 all pixels on : all pixels are on regardless of ddram data. all pixels off: all pixels are off regardless of ddram data. this command is valid in display on status. the data of ddr a m is not changed by this command. if set both p1 and p0 =1, apoff will be select ed . downloaded from: http:///
13 / 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 lcd driving waveform (1/3bias) line inversion frame inversion figure 14. lcd waveform at l ine inversion (1/3bias) figure 15. lcd waveform at frame inversion (1/3bias) 1frame c o m 0 c o m 1 c o m 2 c o m 3 s e g n s e g n + 1 s e g n + 2 s e g n + 3 s e g n+2 s e g n+3 c o m 3 s t a t e a s e g n s e g n+1 c o m 0 c o m 1 c o m 2 s t a t e b vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd (vdd-vlcd) 2/3 (vdd-vlcd) 1/3 (vdd-vlcd) -1/3 (vdd-vlcd) -2/3 (vdd-vlcd) - (vdd-vlcd) s t a t e a ( c o m 0 - s e g n ) 0 s t a t e b ( c o m 1 - s e g n ) (vdd-vlcd) 2/3 (vdd-vlcd) 1/3 (vdd-vlcd) -1/3 (vdd-vlcd) -2/3 (vdd-vlcd) - (vdd-vlcd) 0 1frame c o m 0 c o m 1 c o m 2 c o m 3 s e g n s e g n + 1 s e g n + 2 s e g n + 3 c o m 2 c o m 3 c o m 0 s t a t e a c o m 1 s t a t e b s e g n s e g n+1 s e g n+2 s e g n+3 vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd (vdd-vlcd) 2/3 (vdd-vlcd) 1/3 (vdd-vlcd) -1/3 (vdd-vlcd) -2/3 (vdd-vlcd) - (vdd-vlcd) s t a t e a ( c o m 0 - s e g n ) 0 s t a t e b ( c o m 1 - s e g n ) (vdd-vlcd) 2/3 (vdd-vlcd) 1/3 (vdd-vlcd) -1/3 (vdd-vlcd) -2/3 (vdd-vlcd) -(vdd-vlcd) 0 downloaded from: http:///
14 / 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 (1/2bias) line inversion frame inversion figure 16. lcd waveform in l ine inversion (1/2bias) figure 17. lcd waveform in frame inversion (1/2bias) 1frame c o m 0 c o m 1 c o m 2 c o m 3 s e g n s e g n + 1 s e g n + 2 s e g n + 3 s e g n s e g n+1 s e g n+2 s e g n+3 c o m 0 s t a t e a c o m 1 s t a t e b c o m 2 c o m 3 vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd s t a t e b ( c o m 1 - s e g n ) s t a t e a ( c o m 0 - s e g n ) (vdd-vlcd) 1/2 (vdd-vlcd) - 1/2 (vdd-vlcd) -(vdd-vlcd) 0 (vdd-vlcd) 1/2 (vdd-vlcd) - 1/2 (vdd-vlcd) -(vdd-vlcd) 0 1frame c o m 0 c o m 1 c o m 2 c o m 3 s e g n s e g n + 1 s e g n + 2 s e g n + 3 s e g n s e g n+1 c o m 2 c o m 3 s e g n+2 s e g n+3 c o m 0 s t a t e a c o m 1 s t a t e b vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd vdd vlcd (vdd-vlcd) 1/2 (vdd-vlcd) - 1/2 (vdd-vlcd) -(vdd-vlcd) 0 s t a t e a ( c o m 0 - s e g n ) s t a t e b ( c o m 1 - s e g n ) (vdd-vlcd) 1/2 (vdd-vlcd) - 1/2 (vdd-vlcd) -(vdd-vlcd) 0 downloaded from: http:///
15 / 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 example of display data if lcd layout pattern is like figure 18 and figure 19, and display pattern is like figure 20 , display data will be shown as below. figure 18 . example com l ine pattern figure 19 . example seg line pattern figure 20 . example display pattern s e g 0 s e g 1 s e g 2 s e g 3 s e g 4 s e g 5 s e g 6 s e g 7 s e g 8 s e g 9 s e g 10 s e g 11 s e g 12 s e g 13 s e g 14 s e g 15 s e g 16 s e g 17 s e g 18 s e g 19 com0 d0 0 1 1 0 1 1 1 1 0 1 0 0 0 0 0 0 0 0 0 0 com1 d1 0 0 1 1 1 0 0 1 1 1 1 0 0 0 0 0 0 0 0 0 com2 d2 0 0 0 1 0 1 0 0 1 1 1 0 0 0 0 0 0 0 0 0 com3 d3 0 0 1 1 0 0 0 1 0 1 0 0 0 0 0 0 0 0 0 0 address 00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0ah 0bh 0ch 0dh 0eh 0fh 10h 11h 12h 13h seg1 seg2 seg3 seg4 seg5 seg6 seg7 seg8 seg9 seg10 com1 com2 com3 com0 downloaded from: http:///
16 / 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 initialize sequence follow the power-on sequence below to initi al ize condition. power on stop condition start condition issue slave address execute software reset by sending icset command. after power-on and before sending initialize sequence, e ach register value, ddram address and ddram data are random. start sequence start sequence example1 no. input d7 d6 d5 d4 d3 d2 d1 d0 descriptions 1 power on vdd=05v (tr: min 1ms to max 5 00 ms) 2 wait 100s initialize ic 3 stop stop condition 4 start start condition 5 slave address 0 1 1 1 1 1 0 0 issue slave address 6 icset 1 1 1 0 1 * 1 0 software reset 7 blkctl 1 1 1 1 0 * 0 0 blink off 8 disctl 1 0 1 0 0 1 0 0 80hz, frame inv., power save mode1 9 icset 1 1 1 0 1 * 0 1 external clock input 10 adset 0 0 0 0 0 0 0 0 ram address set 11 display data * * * * * * * * address 00h to 01h display data * * * * * * * * address 02h to 0 3h display data * * * * * * * * address 12h to 1 3h 12 stop stop condition 13 start start condition 14 slave address 0 1 1 1 1 1 0 0 issue slave address 15 modeset 1 1 0 * 1 0 * * display on, 1/3bias 16 stop stop condition (*: don ? t care) downloaded from: http:///
17 / 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 start sequence example2 bu91796muf-m is initialized with start sequence, starts to display with dispon sequence , updates display data with ram write sequence and stops the display with dispoff sequence . execute dispon sequence in order to restart display. abnormal operation may occur in bu91796muf-m due to the effect of n oise or other external factor. to avoid this phenomenon, it is highly recommended to i nput command according to sequence described above during initialization, display on/off and refresh of ram data. initialize sequence dispon sequence ram write sequence dispoff sequence initialize ram write dispoff dispon initialize sequence d7 d6 d5 d4 d3 d2 d1 d0 slave address 0 1 1 1 1 1 0 0 icset 1 1 1 0 1 0 1 0 modeset 1 1 0 0 0 0 0 0 adset 0 0 0 0 0 0 0 0 display data * * * * * * * * dispon sequence d7 d6 d5 d4 d3 d2 d1 d0 slave address 0 1 1 1 1 1 0 0 icset 1 1 1 0 1 0 0 0 disctl 1 0 1 1 1 1 1 1 blkctl 1 1 1 1 0 0 0 0 apctl 1 1 1 1 1 1 0 0 modeset 1 1 0 0 1 0 0 0 ram write sequence d7 d6 d5 d4 d3 d2 d1 d0 slave address 0 1 1 1 1 1 0 0 icset 1 1 1 0 1 0 0 0 disctl 1 0 1 1 1 1 1 1 blkctl 1 1 1 1 0 0 0 0 apctl modeset adset 0 0 0 0 0 0 0 0 display data * * * * * * * * dispoff sequence d7 d6 d5 d4 d3 d2 d1 d0 slave address 0 1 1 1 1 1 0 0 icset 1 1 1 0 1 0 0 0 modeset 1 1 0 0 0 0 0 0 input data description power on wait 100us stop start stop input data description start stop input data description start stop stop input data description start execute software reset display off ram address set display data execute internal osc mode set display control set blkctl set apctl display on execute internal osc mode set display control set blkctl set apctl display on ram address set display data execute internal osc mode display off 1 1 1 1 1 1 0 0 1 1 0 0 1 0 0 0 downloaded from: http:///
18 / 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 vdd tf tr toff vbot cautions in power on/off bu91796muf-m has p.o.r (power -on reset) circuit and software reset function. keep the following recommended power-on conditions in order to power up properly. set power up conditions to meet the recommended tr, tf, toff, and vbot specification below in order to ensure p.o.r operation. set pin test2 =l to enable por circuit. recommended condition of tr, tf, toff, vbot (ta=25c) tr (note) tf (note) toff (note) vbot (note) 1ms to 500ms 1ms to 500ms min 20ms less than 0. 1v (not e) th is function is guaranteed by design, not tested in production process. figure 21. power on/off waveform if it is difficult to keep above conditions, execute the foll owing sequence as quickly as possible after power-on. setting test2="h" disables the por circuit, in such case, execute th e following sequence. note however that it cannot accept command while supply is un stable or below the minimum supply range. note also that software reset is not a complete alternative to por func tion. 1. generate stop condition s to p condition sda scl vdd figure 22. stop condition 2. generate start condition. start condition sda scl vdd figure 23. start condition 3. issue slave address 4. execute software reset (icset) command downloaded from: http:///
19 / 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic ? s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the groun d and supply lines of the digital block from affecting the a nalog bl ock. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capac itors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin a t any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trace s, the two ground traces should be routed separately but connected to a single ground at the reference point of the a pplication board to avoid fluctuations in the small-si gnal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and th ick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute max imum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence a nd delays, especially if the ic has more than one power supply. therefore, give special consideration to power coup ling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors compl etely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when moun ting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. downloaded from: http:///
20 / 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos tra nsistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric fi eld from the outside can easily charge it. the small charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably fo rmed creating parasitic diodes or transistors. the operati on of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic element s to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furtherm ore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power sup ply voltage is applied, make sure that the input pins ha ve voltages within the values specified in the electrical characte ristics of this ic. 13. data transmission to refrain from data transmission is strongly recommended whi le power supply is rising up or falling down to preven t from the occurrence of disturbances on transmission and reception . downloaded from: http:///
21 / 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 ordering information b u 9 1 7 9 6 m u f - m e 2 part number package product rank m: for automotive packaging and forming specification e2: embossed tape and reel mu f : vqfn 32 fv 5050 lineup package orderable part number vqfn32fv5050 reel of 2500 BU91796MUF-ME2 marking diagram vqfn32fv5050 (top view) 91796 part number marking lot number 1pin mark downloaded from: http:///
22 / 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 physical dimension tape and reel information package name vqfn32fv5050 downloaded from: http:///
23 / 23 bu 9 17 96muf-m max 80 segment s (seg 20 com4) datasheet tsz02201-0p4p0d301020-1-2 8.feb.2016 rev.001 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 revision history date revision changes 8 . feb. 2016 00 1 first release downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extreme ly high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in advance. unless otherwise agreed in writin g by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific applic ations japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adeq uate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are no t designed under any special or extraordinary environments or conditions, as exemplified below . accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or c onditions (as exemplified below), your independent verification and confirmation of product performance, reliabil ity, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7. de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts, please consult with th e rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-paa-e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contain ed in this document are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take p roper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate if the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert its intellectual property rights or other rights a gainst you or your customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in p art, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified , reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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